Flexible Electronics News

IBM, Applied Materials and UAlbany NanoCollege to Develop Process Modeling Technology for Manufacturing 22nm Chips

FinFETs are considered a potential successor to conventional planar transistors for 22nm chips

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By: DAVID SAVASTANO

Editor, Ink World Magazine

IBM Corporation, Applied Materials, Inc. and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany (UAlbany NanoCollege) announced an agreement to jointly develop process modeling technology for manufacturing 22 nanometer (nm) logic and memory chips. The project will combine IBM’s semiconductor technology research and development leadership and computer modeling expertise with Applied’s semiconductor processing knowledge to develop predictive models that can help...

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